Low-VOC cleaning substrates and compositions containing a quaternary ammonium compound

ABSTRACT

A cleaning composition for sanitizing and/or disinfecting hard surfaces, comprising: a cationic biocide, surfactant and low levels of VOC solvents. The cleaning composition is adapted to clean a variety of hard surfaces without leaving behind a visible residue and creates low levels of streaking and filming on the treated surface. The cleaning composition contains less than 5% by weight of VOCs. The cleaning composition may be used alone as a liquid or spray formulation or in combination with a substrate, for example, a pre-loaded cleaning wipe.

CROSS-REFERENCES TO RELATED APPLICATIONS

This application is a Continuation Application and claims priority toco-pending U.S. application Ser. No. 16/536,015, filed on Aug. 8, 2019,which is a Continuation of U.S. application Ser. Nos. 16/371,788 and16/371,775, filed on Apr. 1, 2019, which are now U.S. Pat. Nos.10,358,624 and 10,358,623 respectively, which both are Continuations ofU.S. application Ser. No. 15/923,441, filed on Mar. 16, 2018, which isnow U.S. Pat. No. 10,421,929, which is a Continuation of U.S.application Ser. No. 14/954,663, filed on Nov. 30, 2015, which is nowU.S. Pat. No. 9,988,594, which is a Continuation of U.S. applicationSer. No. 14/317,835, filed on Jun. 27, 2014, which is now U.S. Pat. No.9,234,165, which is a Continuation of U.S. application Ser. No.14/174,698, filed on Feb. 6, 2014, which is now U.S. Pat. No. 9,006,165,which is a Continuation of U.S. application Ser. No. 13/543,232, filedon Jul. 6, 2012, which is now U.S. Pat. No. 8,648,027, all of which arehereby incorporated by reference.

The present invention relates to cleaning compositions that include acationic biocide and has low levels of volatile organic compounds(VOCs). The cleaning composition can be used alone, in combination withone or more other cleaning compositions, and/or in combination wipe,towel, cloth, rag, sponge, mop, squeegee, and the like.

BACKGROUND OF THE INVENTION

Many types of cleaning compositions have been developed to clean varioustypes of products and/or surfaces. Some of these cleaning compositionsincluded one or more compounds to disinfect, sanitize, and/or sterilizethe product and/or surface. The present invention relates to a cleaningcomposition that includes at least one cationic biocide such as, but notlimited to, quaternary ammonium salts (“quats”) as the anti-microbialactive. The cleaning composition can include other traditionalanti-microbial actives such as, but not limited to, one or more acidsand/or alcohols. In addition, the cleaning composition also includes oneor more surfactants and one or more solvents which together provideexcellent cleaning efficacy with low levels of residue and little to novisible streaking and filming on the surface being treated. Othertraditional cleaning compositions with good cleaning efficacy and lowlevels of visible residue contain higher levels of VOC solvents, forexample between 1-40% by weight of the composition. The cleaningcomposition is envisioned as being used in a wide variety ofapplications. As can be appreciated, the additives, the surfactants, thesolvents and the cationic biocides used in the cleaning compositions,may vary depending on the particular application of the cleaningcomposition.

One type of biocide that has been used in cleaning wipes is quaternaryamines or “quats”. Liquid cleaners applied to cleaning wipes typicallyinclude relatively large amounts of quat. These cleaning wipes aretypically used on hard surfaces such as floors, countertops, glasssurfaces, sinks, toilets, appliances, and/or the like. Although quatsare excellent biocides, quats can cause skin irritation when used in toohigh of concentrations. In addition, not all of the quat may be releasedfrom the wipe when the wipe is applied to a surface, thus added quat isincluded in the liquid cleaner to ensure that the desired amount of quattransfers to the cleaned surface. Other biocides such as biguanidecompounds also have a low release rate from the wipe. Since the quatand/or biguanide compound is typically one of the higher cost componentsof the cleaner, the larger quat and/or biguanide concentrations used inthe liquid cleaner translates into higher product costs. There have beenvarious attempts to develop liquid cleaners having improved quat releasefrom the cleaning wipes. Some cleaning formulations use a high weightpercentage of VOCs to promote quat release from the cleaning wipe. Ithas been observed that isopropyl alcohol in amounts of over about 12%can improve the quat release from the wipe. The use of isopropyl alcoholis also beneficial in that the alcohol has its own antimicrobialproperties and cost substantially less than quats. Although the use ofisopropyl alcohol in the cleaning formulation improves quat release fromthe wipe, a substantial amount of quat still remains on the cleaningwipe after use. In addition, local, state and/or federal governmentshave begun to promulgate regulations on the amount of VOCs can be usedin cleaners. As a result, cleaners having high concentrations (e.g.greater than 0.5% by weight of the composition) of VOCs may be lesspreferred.

In addition, quats also tend to leave residues and/or cause streakingafter being applied to various surfaces. The residue and streakingproblems are of great concern to consumers since the visual appearanceof the cleaned surface functions as an indicator of the effectiveness ofthe cleaner. Consumers also judge the cleaning effectiveness of thecleaner by touching the cleaned surface. Sticky surfaces typicallyindicate to the consumer that the surface has not been effectivelycleaned. Cleaning formulations that tend to leave residues and/or causestreaking tend to produce a less shiny, thus a visually perceived lessclean surface, and further tend to leave a sticky surface. This isespecially true with mop and pre-loaded wipe applications, where suchcompositions are left to dry on the surface without rinsing. As aresult, the consumer perceives that the cleaned surface has not beeneffectively cleaned irrespective of the fact the surface may have beenproperly cleaned and disinfected. Liquid cleaners having high quatcontent are also subject to various local, state and/or federalregulations due to the toxicity of the quat in high concentrations.

In view of the present state of the art of cleaning compositions, thereis a demand for a low VOC formulation with excellent cleaning efficacythat can be used in a variety of applications to disinfect, sanitize,and/or sterilize surfaces without leaving undesired residues and/orstreaking on the cleaned surface, and/or which cleaning composition iscost effective to use.

SUMMARY OF THE INVENTION

The present invention is related to a cleaning composition that includesa cationic biocide. The cleaning composition is generally a liquidcleaner or a liquid loaded onto a substrate; however, the cleaningcomposition may be in an aerosol, liquid spray or semi-solid form. Thecleaning composition can be used by itself or combined with othercleaning formulations. The cleaning composition of the present inventionhas: excellent cleaning performance, low levels of streaking and filmingand/or visible residue, and has low levels of VOCs, less than 5% byweight of the composition; or less than about 3% by weight; or even lessthan 2% by weight of the composition.

Typically high-VOC formulations are used for low streaking and filmingcleaners because there is no phase separation as the formulation drieson a hard surface that is being cleaned. The present invention teachesthat it is possible to have a low VOC cleaning formulation that has goodfilming/streaking performance even though the composition does phaseseparate upon drying on a treated surface. The low VOC cleaningformulation of the present invention creates a regular micron-structureand leaves a residue on the surface being treated/cleaned, but theresidue forms a regular pattern of light and dark areas with a lengthscale below the visual threshold of what the human eye perceives.Therefore, although the cleaning composition of the present inventionleaves a residue on the treated surface, the residue is substantiallyinvisible to the human eye.

As the cleaning composition of the present invention dries on thesurface, two processes occur: dewetting and phase separation. Dewettingis when the liquid film ruptures upon drying to form individual drops.Depending on the specific formulation, if the cloud point of theformulation is at 95° F. or less; or 90° F. or less, or even 85° F. orless then phase separation will occur before dewetting which allows forthe cleaning composition to form a regular micron-scale structure andthat leads to a residue that contains a regular pattern of smalldroplets. The regular pattern of small droplets is substantiallyinvisible to the human eye as a residue on the treated surface. Incontrast a low VOC cleaning composition with a higher cloud point, above95° F., or above 90° F. or even above 85° F., depending on the specificformulation, dries in a different manner because dewetting occurs beforephase separation, and this creates an irregular pattern of droplets anda visually apparent residue of streaking and filming.

In one embodiment, the present invention teaches a cleaning compositioncomprising: a. about 0.05-5% by weight of a cationic biocide, b. about0.01-5% by weight of a non-ionic surfactant, and c. about 0.05-10% byweight of glycol ether solvent, wherein said composition has a cloudpoint that is less than about 85° F. In another embodiment, the presentinvention teaches a cleaning composition comprising: a. about 0.05-5% byweight of a cationic biocide, b. about 0.01-5% by weight of analkoxylate surfactant, and c. about 0.05-10% by weight of solvent,wherein when a 0.5 microliter drop of said composition deposited on aclean silicon surface, forms a circular residue where, within thecentral 80% of the droplet residue image, there is no position where a200-micron diameter circle can be placed where it will contain noboundaries between the dark and light portions of the image. In anotherembodiment, the present invention teaches a method of cleaning a hardsurface comprising the following steps: a. creating a cleaningcomposition comprising: i. about 0.05-5% by weight of a cationicbiocide, ii. about 0.01-5% by weight of a nonionic surfactant, and iii.about 0.05-10% by weight of solvent, b. applying said cleaningcomposition to a substrate; cleaning a hard surface using the substrateloaded with said cleaning composition; and wherein when a 0.5 microliterdrop of said composition deposited on a clean silicon surface, forms acircular residue where, within the central 80% of the droplet residueimage, there is no position where a 200-micron diameter circle can beplaced where it will contain no boundaries between the dark and lightportions of the image.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a graph showing how different surfactants have varying cloudpoints depending on the weight % of ethylene glycol monohexyl ether(i.e. hexyl cellosolve) in the composition.

FIG. 2 is a graph showing how three EO-PO surfactants have varying cloudpoints depending on the weight % of ethylene glycol monohexyl ether inthe composition.

FIG. 3 is a microscopy image of a dried droplet residue of a cleaningcomposition according to the present invention with a low cloud point,79° F., and a regular micron-structure.

FIG. 4 is a microscopy image of a dried droplet residue of a cleaningcomposition with poor streaking and filming performance. The compositionof the dried droplet has a high cloud point, 110° F., and an irregularmicron-structure.

FIG. 5 is a set of four microscopy images showing the surface residue ofa droplet of low-VOC cleaning compositions of the present invention withthe same surfactant but different cloud points. The upper leftcomposition has a cloud point of 85° F. The upper right composition hascloud point of 83° F. The lower left composition has a cloud point of81° F. The lower right composition has a cloud point of 78° F.

DETAILED DESCRIPTION OF THE INVENTION

Before describing the present invention in detail, it is to beunderstood that this invention is not limited to particularlyexemplified systems or process parameters that may, of course, vary. Itis also to be understood that the terminology used herein is for thepurpose of describing particular embodiments of the invention only, andis not intended to limit the scope of the invention in any manner.

All publications, patents and patent applications cited herein, whethersupra or infra, are hereby incorporated by reference in their entiretyto the same extent as if each individual publication, patent or patentapplication was specifically and individually indicated to beincorporated by reference.

It must be noted that, as used in this specification and the appendedclaims, the singular forms “a,” “an” and “the” include plural referentsunless the content clearly dictates otherwise. Thus, for example,reference to a “surfactant” includes two or more such surfactants.

References herein to “one embodiment”, “one aspect” or “one version” ofthe invention include one or more such embodiment, aspect or version,unless the context clearly dictates otherwise.

Unless defined otherwise, all technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which the invention pertains. Although a number of methodsand materials similar or equivalent to those described herein can beused in the practice of the present invention, the preferred materialsand methods are described herein.

In the application, effective amounts are generally those amounts listedas the ranges or levels of ingredients in the descriptions, which followhereto. Unless otherwise stated, amounts listed in percentage (“%'s”)are in active weight percent (based on 100% active) of the activecomposition alone, unless otherwise indicated.

The term “comprising”, which is synonymous with “including,”“containing,” or “characterized by,” is inclusive or open-ended and doesnot exclude additional, unrecited elements or method steps. See MPEP2111.03. See, e.g., Mars Inc. v. H.J. Heinz Co., 377 F.3d 1369, 1376, 71USPQ2d 1837, 1843 (Fed. Cir. 2004) (“like the term ‘comprising,’ theterms ‘containing’ and ‘mixture’ are open-ended.”). Invitrogen Corp. v.Biocrest Mfg., L.P., 327 F.3d 1364, 1368, 66 USPQ2d 1631, 1634 (Fed.Cir. 2003) (“The transition ‘comprising’ in a method claim indicatesthat the claim is open-ended and allows for additional steps.”);Genentech, Inc. v. Chiron Corp., 112 F.3d 495, 501, 42 USPQ2d 1608, 1613(Fed. Cir. 1997) See MPEP 2111.03. (“Comprising” is a term of art usedin claim language which means that the named elements are essential, butother elements may be added and still form a construct within the scopeof the claim.); Moleculon Research Corp. v. CBS, Inc., 793 F.2d 1261,229 USPQ 805 (Fed. Cir. 1986); In re Baxter, 656 F.2d 679, 686, 210 USPQ795, 803 (CCPA 1981); Ex parte Davis, 80 USPQ 448, 450 (Bd. App. 1948).See MPEP 2111.03.

The term “consisting essentially of” as used herein, limits the scope ofa claim to the specified materials or steps “and those that do notmaterially affect the basic and novel characteristic(s)” of the claimedinvention. In re Herz, 537 F.2d 549, 551-52, 190 USPQ 461, 463 (CCPA1976) (emphasis in original). See MPEP 2111.03.

The term “consisting of” as used herein, limits the scope of a claim tothe specified materials or steps, indicating that the claim orlimitation to which it pertains is closed, not allowing for additionalsteps or materials.

All numbers expressing quantities of ingredients, constituents, reactionconditions, and so forth used in the specification and claims are to beunderstood as being modified in all instances by the term “about”.Notwithstanding that the numerical ranges and parameters setting forththe broad scope of the subject matter presented herein areapproximations, the numerical values set forth in the specific examplesare reported as precisely as possible. Any numerical value, however,inherently contains certain errors necessarily resulting from thestandard deviation found in their respective testing measurements.”

As used herein, the term “disinfect” shall mean the elimination of manyor all pathogenic microorganisms on surfaces with the exception ofbacterial endospores.

As used herein, the term “sanitize” shall mean the reduction ofcontaminants in the inanimate environment to levels considered safeaccording to public health ordinance, or that reduces the bacterialpopulation by significant numbers where public health requirements havenot been established. An at least 99% reduction in bacterial populationwithin a 24 hour time period is deemed “significant.”

As used herein, the terms “substrate” or “wipe” are intended to includeany material on which a cleaning composition may be loaded. Infunctional application, a substrate is used to clean an article or asurface, as by wiping. Substrates comprise woven or nonwoven materials,typically made from a plurality of fibers, as well as sponges, films andsimilar materials onto which cleaning compositions can be loaded asdescribed herein. The substrate can be used by itself (typically byhand) or attached to a cleaning implement, such as a floor mop, handle,or a hand held cleaning tool, such as a toilet cleaning device.

“Cleaning composition” as used herein, is any fluid and/or solidcomposition used for cleaning hard and/or soft surfaces. Cleaning meansany treatment of a surface which serves to remove or reduce unwanted orharmful materials such as soil, dirt or microbial contamination from asurface, and/or which imparts a desirable or beneficial aesthetic,health or safety effect to the surface such as depositing thereon afragrance, color or protective coating or film.

“Pre-loaded wipes” as used herein, are wipes which are moistened, suchas by wetting the wipe with a liquid composition prior to use by theconsumer. “Pre-loaded wipes” as used herein, may also refer to wipesthat are moistened prior to packaging in a generally moisture imperviouscontainer or wrapper. “Pre-loaded wipes” as used herein may even includedry wipes that are impregnated with liquid and dried prior to packagingor solid actives, including but not limited to cleaning agents.Furthermore, “pre-loaded wipes” as referred to herein may in addition,or in the alternative, include wet wipes that have been pre-moistenedwith liquid compositions, including but not limited to, liquidcompositions, such as cleaning agents or lotions.

The term Volatile Organic Compound (VOC) is meant to mean a compoundthat falls under one of the following definitions and is not containedon an exemption list. A VOC is any compound with: (a) a vapor pressure(VP)>0.1 mmHg @ 20° C., (b) a boiling point (BP)<216° C., and (c) lessthan 12 carbons and VP or BP data. The California VOC definition is asfollows, “Volatile Organic Compound (VOC)” means any compound containingat least one atom of carbon, excluding carbon monoxide, carbon dioxide,carbonic acid, metallic carbides or carbonates, and ammonium carbonate,and excluding the following: (A) methane, methylene chloride(dichloromethane), 1,1,1-trichloroethane (methyl chloroform),trichlorofluoromethane (CFC-11), dichlorodifluoromethane (CFC-12),1,1,2-trichloro-1,2,2 trifluoroethane (CFC-113),1,2-dichloro-1,1,2,2-tetrafluoroethane (CFC-114),chloropentafluoroethane (CFC-115), chlorodifluoromethane (HCFC-22),1,1,1-trifluoro-2,2-dichloroethane (HCFC-123),1,1-dichloro-1-fluoroethane (HCFC-141b), 1-chloro-1,1-difluoroethane(HCFC-142b), 2-chloro-1,1,1,2-tetrafluoroethane (HCFC-124),trifluoromethane (HFC-23), 1,1,2,2-tetrafluoroethane (HFC-134),1,1,1,2-tetrafluoroethane (HFC-134a), pentafluoroethane (HFC-125),1,1,1-trifluoroethane (HFC-143a), 1,1-difluoroethane (HFC-152a),ethoxy-nonafluorobutane (HFE 7200), cyclic, branched, or linearcompletely methylated siloxanes, the following classes ofperfluorocarbons: 1. cyclic, branched, or linear, completely fluorinatedalkanes; 2. cyclic, branched, or linear, completely fluorinated etherswith no unsaturations; 3. cyclic, branched, or linear, completelyfluorinated tertiary amines with Consumer Products Regulation 33 nounsaturations; and 4. sulfur-containing perfluorocarbons with nounsaturations and with the sulfur bonds to carbon and fluorine, and (B)the following low-reactive organic compounds which have been exempted bythe U.S. EPA: acetone, ethane, methyl acetate,parachlorobenzotrifluoride (1-chloro-4-trifluoromethyl benzene),perchloroethylene (tetrachloroethylene).

In one embodiment of the present invention, the cleaning composition canbe loaded onto an absorbent and/or absorbent material, and/or can beused separately from an absorbent and/or absorbent material. Theabsorbent and/or absorbent material includes, but is not limited to,cleaning wipes, cloths, sponges (e.g., cellulose, synthetic, etc.),paper towels, napkins, rags, mop heads, cleaning pads, towels, brooms,other absorbent cleaning tools, and/or the like.

In another embodiment of the present invention, the cleaning compositionis applied to a surface to be cleaned prior to exposing the cleaningcomposition to an absorbent and/or adsorbent material. In suchapplications, the cleaning composition is not pre-loaded onto anabsorbent and/or adsorbent material, but instead is applied by the userto a surface to be cleaned and then wiped up by the absorbent and/oradsorbent material. As can be appreciated, the absorbent and/oradsorbent material can include some cleaning composition prior to wipingthe surface on which the cleaning composition is pre-applied. In anotherand/or alternative embodiment of the present invention, the cleaningcomposition is pre-applied to the absorbent and/or absorbent materialfor ease of use by the consumer. The cleaning composition can bepackaged to be used alone or in combination with other cleaners and/orabsorbent or adsorbent materials.

The cleaning composition is typically formulated to clean hard surfacessuch as, but not limited to, counter tops; however, the cleaningcomposition has much broader applications and be used as a clean glasscleaner; appliance cleaner; floor cleaner; rug cleaner; area disinfect,sanitizer, and/or sterilizer; and/or the like. As used herein, the term“hard surfaces” includes, but is not limited to, bathroom surfaces(e.g., floor, tub, shower, mirror, toilet, bidet, bathroom fixtures,etc.), kitchen surfaces (e.g., counter tops, stove, oven, range, sink,refrigerator, microwave, appliances, tables, chairs, cabinets, drawers,floors, etc.), furniture surfaces (e.g., tables, chairs, sofas, loveseats, benches, beds, stools, armoires, chests, dressers, displaycabinets, clocks, buffet, shades, shutters, entertainment centers, armrails, lamps, banisters, libraries, cabinets, desks, doors, shelves,couches, beds, carts, pianos, statues and other art, mirrors, racks,fans, light fixtures, pool table, ping pong table, soccer table, cardtable, etc.), statues, windows, window ledges, tools, utility devices(e.g., telephones, radios, televisions, stereo equipment, CD and DVDplayers, analog and digital sound devices, palm computers, laptopcomputers, desktop and tower computers, computer monitors, etc.),automobiles (e.g., interior and exterior surfaces), bicycles,snowmobiles, motorcycles, off-road-vehicles, yard equipment, farmequipment, washing equipment (e.g., power washers, etc.), paintingequipment (e.g., electric and air powered painting equipment, etc.),medical and/or dental equipment, marine equipment (e.g., sail boats,power boats, rafts, sail board, canoe, row boats, etc.), toys, writingimplements, watches, framed pictures or paintings, books, and/or thelike. The cleaning composition can also be used in a variety ofindustrial and institutional applications. As used herein, the terms“industrial” and “institutional” shall mean the fields of use whichinclude, but are not limited to, contract (e.g., professional) cleaningand disinfecting, retail facilities cleaning and disinfecting,industrial/manufacturing facilities cleaning and disinfecting, officecleaning and disinfecting services, hotel/restaurant/entertainmentcleaning and disinfecting, health care (e.g., hospitals, urgent carefacilities, clinics, nursing homes, medical/dental offices,laboratories) facilities cleaning and disinfecting, educationalfacilities cleaning and disinfecting, recreational (e.g., arenas,coliseums, resorts, halls, stadiums, cruise lines, arcades, conventioncenters, museums, theaters, clubs, family entertainment complexes (e.g.,indoor and/or outdoor), marinas, parks) facilities cleaning anddisinfecting, food service facilities cleaning and disinfecting,governmental facilities cleaning and disinfecting, public transportationfacilities (e.g., airports, airlines, cabs, buses, trains, subways,boats, ports, and their associated properties) cleaning anddisinfecting. The cleaning composition can be in concentrated form orunconcentrated form (e.g., ready to use form). When the cleaningcomposition is not first impregnated on an absorbent or adsorbentmaterial, the cleaning composition can be dispensed and/or sprayed asliquid from a container, as an aerosol from an aerosol container, or asa crystal, powder, paste, or otherwise semi-solid or solid form from acontainer.

In one aspect of the present invention, the absorbent and/or absorbentmaterial can be at least partially impregnated with the cleaningcomposition. When the cleaning composition is at least partially loadedor impregnated onto the absorbent and/or absorbent material, thecleaning composition is formulated to have a viscosity that allows suchloading. Typically, the viscosity of the cleaning composition is lessthan about 1000 centipoise (“cps”) when the cleaning composition is atleast partially loaded or impregnated onto an absorbent and/or absorbentmaterial. The viscosity of the cleaning composition can be greater than1000 cps when the cleaning composition is used separately from anabsorbent and/or absorbent material, and/or is not to be preloaded ontoan absorbent and/or absorbent material.

In yet another and/or alternative aspect of the present invention, a kitis provided for cleaning which kit includes the cleaning composition ofthe present invention. The kit can have an assembly of one or moreunits, either packaged together or separately. For example, the kit caninclude cleaning pads and/or wipes, and a container of the cleaningcomposition. A second example is a kit with cleaning pads and/or wipes,implement and a container of the cleaning composition. A third exampleis a kit with a refill (concentrated or unconcentrated), a container ofready to use cleaning composition, and cleaning pads and/or wipes thatinclude a superabsorbent material. In one embodiment, the implement thatincludes a cleaning pad and/or wipe that includes a superabsorbentmaterial, and when used with the cleaning composition provides effectivecleaning and good particulate soil removal. In one aspect of thisembodiment, the cleaning pad and/or wipe is a disposable and/or does notrequire rinsing. In another and/or alternative embodiment, the cleaningpad and/or wipe is detachably mounted on the implement. In one aspect ofthis embodiment, the cleaning pad and/or wipe can be removed andreplaced by another cleaning pad and/or wipe. This is especially useful,when the cleaning pad and/or wipe is excessively soiled. The cleaningpad and/or wipe can be removed and replaced with a fresh cleaning padand/or wipe. In still another and/or alternative aspect of thisembodiment, the implement includes a dosing device. The dosing device atleast partially delivers the cleaning composition to the surface to becleaned and/or applies at least a portion of the cleaning composition onthe cleaning pad and/or wipe. The dosing device can be battery powered,electrically powered, or hand powered. In still yet another and/oralternative embodiment, a reservoir is provided that is designed to atleast partially hold the cleaning composition. In one aspect of thisembodiment, the reservoir is detachably mounted on the implement. Inanother and/or alternative aspect of this embodiment, the reservoir isused in combination with a dosing device.

In yet another and/or alternative aspect of the present invention, thecleaning composition can be at least partially loaded onto an absorbentand/or adsorbent material by a user prior to cleaning. The absorbentand/or adsorbent material can include cleaning wipes, sponges (e.g.,cellulose, synthetic, etc.), paper towels, napkins, cleaning pads,cloths, towels, rags, mop heads, and/or the like. In such applications,the cleaning composition is not preloaded or fully preloaded onto anabsorbent and/or adsorbent material, thus the cleaning composition is atleast partially applied by the user just prior to and/or during thecleaning process. When the cleaning composition is used in suchapplication, the cleaning composition is typically packaged in aseparate container or receptacle from the absorbent and/or adsorbentmaterial. During the cleaning process, the cleaning composition isapplied to the absorbent and/or adsorbent material. Additionally oralternatively, the cleaning composition can be applied to the surface tobe cleaned and the absorbent and/or adsorbent material is used to pickup cleaning composition off the surface to be cleaned and/or spread thecleaning composition on the surface to be cleaned. The cleaningcomposition can be applied automatically and/or manually applied to theabsorbent and/or adsorbent material and/or onto the surface to becleaned.

In still another and/or alternative aspect of the present invention, thecleaning composition can be applied to a surface to be cleaned prior toexposing the cleaning composition to an absorbent and/or adsorbentmaterial. The absorbent and/or adsorbent material can include cleaningwipes, sponges (e.g., cellulose, synthetic, etc.), paper towels,napkins, cleaning pads, cloths, towels, rags, mop heads, and/or thelike. In such applications, the cleaning composition is not preloadedonto an absorbent and/or adsorbent material, but applied by the user toa surface to be cleaned and then wiped up by the absorbent and/oradsorbent material. The cleaning composition can be appliedautomatically and/or manually applied to the surface to be cleaned.

In still yet another and/or alternative aspect of the present invention,the cleaning composition can be applied and/or added to a surface and/orenvironment to be cleaned without ever applying the cleaning compositionto an absorbent and/or adsorbent material. Examples of such uses of thecleaning composition include, but are not limited to, air fresheners,shampoos, hand lotions/cleaners, cleaners for cleaning internalcomponents of machinery and/or process lines, carpet fresheners, carpetcleaners, cat litter, drain cleaners, toilet cleaners, environmentcleaners (e.g., fumigation gas and/or fluid, liquid spray, etc.), and/orthe like.

In still another and/or alternative aspect of the present invention, thecleaning composition includes an effective amount of biocide to obtainthe desired disinfecting, sanitizing, and/or sterilizing qualities ofthe cleaning composition. The cleaning composition includes one or morebiocides to achieve the desired disinfecting, sanitizing, and/orsterilizing qualities of the cleaning composition. The cleaningcomposition is typically formulated to partially or completely killmicroorganisms such as, but not limited to, bacteria, fungi, molds,mildew, and/or viruses. The antimicrobial efficacy of the cleaningcomposition can be tailored for a particular household, industrialand/or institutional application, and/or can be formulated to disinfectsanitize, and/or sterilize surfaces in household, industrial and/orinstitutional environments. In one embodiment, the biocide in thecleaning composition is a cationic biocide. Such cationic biocideincludes, but not limited to, quats and/or biguanide compounds. Inanother and/or alternative embodiment, the biocide in the cleaningcomposition includes a cationic biocide and at least one other type ofbiocide.

In still another and/or alternative aspect of the present invention, thecleaning composition includes and/or is used in combination with aneffective amount of one or more surfactants. The inclusion of thesurfactant in the cleaning composition and/or used in combination withthe cleaning composition can improve the cleaning performance of thecleaning composition (e.g., improve wetting properties of the cleaningcomposition, stabilize components in the cleaning composition, functionas an emulsifying agent, reduce filming and/or streaking, etc.).

In still another and/or alternative aspect of the present invention, thecleaning composition can include and/or be used in combination with oneor more solvents. The solvent can be used to dissolve various componentsin the cleaning composition so as to form a substantially uniformlydispersed mixture. In addition to the dispersion and solubilizingfunctions of the solvent, the solvent can function as a cleaning agentto help loosen and solubilize compounds such as greasy or oily soilsfrom surfaces, a residue inhibiting agent to help reduce residues leftbehind on a cleaned surface, a detergent agent to assist in thedetergency of the cleaning composition, and/or a disinfecting,sanitizing, and/or a sterilizing agent to help eliminate variousbacteria and/or viruses on a cleaned surface.

In still yet another and/or alternative aspect of the present invention,the cleaning composition includes and/or is used in combination withwater. The water, when used, can be premixed with the other componentsof the cleaning composition or be partially or fully added to thecleaning composition at the time of or prior to use. The water caninclude tap water, filtered water, bottled water, spring water,distilled water, deionized water, and/or industrial soft water. Theamount of water in and/or combined with the cleaning composition dependson whether the cleaning composition is an aqueous or nonaqueouscomposition. In one embodiment, the water used in and/or used incombination with the cleaning composition is deionized water and/orindustrial soft water. The use of deionized water and/or industrial softwater can reduce the amount of residue formation and can limit theamount of undesirable metal ions in and/or used in combination with thecleaning composition. In another and/or alternative embodiment, thecleaning composition is an aqueous composition, and the waterconstitutes at least a majority weight percent of the cleaningcomposition. The amount of water in the cleaning composition istypically less when the cleaning composition is in a concentrated liquidor semi-liquid form, or in a solid form. In another and/or alternativeembodiment, the cleaning composition is in a concentrated liquid orsemi-liquid form, or in a solid form and is loaded onto a substrate thatis activated by water by the end user.

In a further and/or alternative aspect of the present invention, thecleaning composition includes and/or is used in combination with one ormore adjuncts. The adjuncts include, but are not limited to, bufferingand pH adjusting agents, fragrances or perfumes, waxes, dyes and/orcolorants, solubilizing materials, stabilizers, thickeners, defoamers,hydrotropes, lotions and/or mineral oils, enzymes, bleaching agents,cloud point modifiers, preservatives, ion exchangers, alkalies,anticorrosion materials, antiredeposition materials, opticalbrighteners, chelating agents, enzymes, whiteners, brighteners,antistatic agents, sudsing control agents, hydrotropes, bleachprecursors, soil removal agents, soil release agents, softening agents,opacifiers, inert diluents, graying inhibitors, stabilizers, and/orpolymers.

The advantages of the cleaning composition and cleaning substrate of thepresent invention are that the composition has low levels of VOCs, goodcleaning and disinfecting performance and low streaking and filming onhard surfaces. Other advantages will become apparent to those skilled inthe art upon reading and following the description of the inventiontaken together with the accompanying figures.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The cleaning composition of the present invention can be usedindependently from or in conjunction with an absorbent and/or adsorbentmaterial. For instance, the cleaning composition is formulated to beused in conjunction with a cleaning wipe, sponge (e.g., cellulose,synthetic, etc.), cleaning pad, paper towel, napkin, cloth, towel, rag,mop head, squeegee, and/or other cleaning device that includes anabsorbent and/or adsorbent material. The cleaning composition can beformulated to be loaded onto and/or used in combination with anabsorbent and/or adsorbent material (e.g., cleaning wipe, cleaning pad,mop head, cloth, towel, etc.) to clean hard surfaces. The cleaningcomposition can also or alternatively be formulated to clean fabrics(e.g., clothing, carpet, curtains, rugs, etc.). The cleaning compositioncan also or alternatively be formulated to disinfect and/or sanitizevarious areas and things (e.g., rooms, pet litter, medical equipment,etc.)

The cleaning composition can also or alternatively be formulated for usein personal hygiene products (e.g., hand cleaners, body lotions,shampoos, hair conditioners, etc.). The cleaning composition isparticularly applicable for use with hard surfaces. Such surfacesinclude, but are not limited to, windows, doors, counter tops, floor,sinks, toilets, showers, kitchen appliances, and the like. When cleaninghard surfaces, an important goal is to not only clean, disinfect,sanitize, and/or sterilize the hard surface, but to also reduce filmingand streaking on the hard surface. It is also desirable for the cleanedhard surface to not be sticky. The cleaning composition is formulated toclean, disinfect, sanitize, and/or sterilize hard surfaces, and toreduce filming and streaking on the hard surface without leaving asticky surface on the cleaned hard surface.

The cleaning composition can be in concentrated form or ready-to-useform. The cleaning composition can be in gas, liquid, paste, gel, orsolid form. The cleaning composition can be dispensed from a liquidcontainer, an aerosol container, a container for holding crystals or apaste, and the like. The cleaning composition can be preloaded onto anabsorbent and/or adsorbent material, and/or used in combination with anabsorbent and/or adsorbent material.

The basic components of the cleaning composition for hard surfacesinclude:

-   -   (i) cationic biocide;    -   (ii) solvent with less than 5% VOCs    -   (iii) surfactant.

Additional components can be included in and/or used in combination withthe cleaning composition to add one or more attributes to the cleaningcomposition and/or to enhance the attributes of the cleaningcomposition.

A. The Cationic Biocide

The biocide in the cleaning composition includes a cationic compound.The cationic biocide typically includes one or more biguanide compoundsand/or quats. Biguanide compounds are desirable in that such compoundshave broad spectrum antimicrobial or germicidal properties. Thebiguanide compounds are also less irritating to skin, and produce lessstreaking and residue when applied to a hard surface. As a result, thecleaning composition feels drier after being applied resulting in higherconsumer satisfaction. A variety of different biguanide compounds can beused in the cleaning composition. The biguanide compounds that can beused in the cleaning composition include, but are not limited to,compounds have the following general formula:

where X1 and X2 are either a hydrogen or any aliphatic, cycloaliphatic,aromatic, substituted aliphatic, substituted aromatic, heteroaliphatic,heterocyclic, and/or heteroaromatic compound. X1 and X2 can be the sameor different. Y1 and Y2 are any aliphatic, cycloaliphatic, aromatic,substituted aliphatic, substituted aromatic, heteroaliphatic,heterocyclic, and/or heteroaromatic compound. Y1 and Y2 can be the sameor different. M is a number equal to or greater than 1. Typically, M hasan average value such that the molecular weight of biguanide compoundsis about 1000-1400; however, the molecular can be higher or lower.Generally M is about 2-20. N is a nitrogen atom. Z1 and Z2 are either ahydrogen or a salt. Z1 and Z2 can be the same of different.

Specific examples of these compounds include, but are not limited to,polyhexamethylene biguanide hydrochloride, p-chlorophenyl biguanide; and4-chlorobenzhydryl biguanide. In still yet another and/or alternativeaspect of this embodiment, the biguanide compound includes, but is notlimited to, halogenated hexidine such as, but not limited to,chlorhexidine (1,1′-hexamethylene-bis-5-(4-chlorophenyl biguanide) andits salts. In addition or alternatively, the biguanide compoundsinclude, but are not limited to, halogenated hexidine and its salts. Thesalts include, but are not limited to, salts with an inorganic acid,such as hydrochloride, hydrofluoride, nitrate, sulfate and/or phosphate,and/or salts with an organic acid such as, but not limited to,carboxylic acid, acetate, benzoate, tartrate, adipate, lactate, formate,maleate, glutamate, ascorbate, citrate, gluconate, oxalate, succinate,pamoate, salicylate, isethionate, succinamate, monodiglycolate,dimethanesulfonate, di-isobutyrate, and/or glucoheptonate. Examples ofsalts of chlorhexidine include, but are not limited to, chlorhexidinediphosphanilate, chlorhexidine digluconate, chlorhexidine diacetate,chlorhexidine dihydrochloride, chlorhexidine dichloride, chlorhexidinegluconate, chlorhexidine dihydroiodide, chlorhexidine diperchlorate,chlorhexidine dinitrate, chlorhexidine sulfate, chlorhexidine sulfite,chlorhexidine thiosulfate, chlorhexidine di-acid phosphate,chlorhexidine difluorophosphate, chlorhexidine diformate, chlorhexidinedipropionate, chlorhexidine di-iodobutyrate, chlorhexidine di-valerate,chlorhexidine dicaproate, chlorhexidine malonate, chlorhexidinesuccinate, chlorhexidine malate, chlorhexidine tartrate, chlorhexidinedimonoglycolate, chlorhexidine monodiglycolate, chlorhexidine dilactate,chlorhexidine di-alpha-hydroxyisobutyrate, chlorhexidinediglucoheptonate, chlorhexidine di-isothionate, chlorhexidinedibenzoate, chlorhexidine dicinnamate, chlorhexidine dimandelate,chlorhexidine di-isophthalate, chlorhexidine di-2-hydroxynapthoate, andchlorhexidine embonate. Additional examples of biguanide compounds whichcan be used in the cleaning composition are disclosed in U.S. Pat. Nos.2,684,924; 2,990,425; 3,468,898; 4,022,834; 4,053,636; 4,198,392;6,143,244; 6,143,281; and 6,153,568; EPC 24,031; and DE 1,964,196; DE2,212,259; and DE 2,627,548, which are incorporated herein by reference.

The biguanide compound content of the cleaning composition is generallymaintained at least above 0.0005 weight percent, and more generallyabove about 0.02 weight percent and less than about 10 weight percent;however, higher or lower biguanide compound contents can be used. In oneaspect of this embodiment, the biguanide compound content of thecleaning composition is about 0.05-5 weight percent. In another aspectof this embodiment, the biguanide compound content of the cleaningcomposition is about 0.08-5 weight percent. In still another aspect ofthis embodiment, the biguanide compound content of the cleaningcomposition is about 0.1-2 weight percent. In yet another aspect of thisembodiment, the biguanide compound content of the cleaning compositionis about 0.1-1 weight percent. In still yet another aspect of thisembodiment, the biguanide compound content of the cleaning compositionis about 0.15-0.8 weight percent. In a further aspect of thisembodiment, the biguanide compound content of the cleaning compositionis about 0.175-0.6 weight percent. In yet a further aspect of thisembodiment, the biguanide compound content of the cleaning compositionis about 0.2-0.5 weight percent. In still a further aspect of thisembodiment, the biguanide compound content of the cleaning compositionis about 0.25-0.4 weight percent.

The weight percentage range for the biguanide compound in the cleaningcomposition is selected to disinfect, sanitize, and/or sterilize mostcommon household, institutional, and industrial hard surfaces. Commontypes of bacteria that are at least partially destroyed by biguanidecompounds in the cleaning composition include, but are not limited to,Staphylococcus aureus (Staph), Klebsiella pneumonia (Kleb), Salmonellacholeraesuis (Salmonella), Pseudomonas aeruginosa, Pserratia marcescens,Influenza A2, Candida albicans, Fusarium solani, common viruses and/orfungi.

In yet another and/or alternative aspect of the present invention, thecleaning composition includes a cationic biocide that includes one ormore quats. The cationic biocide in the cleaning composition canprimarily include one or more quats, and/or include one or more othercationic biocides in combination with the one or more quats. Such othercationic biocides include, but are not limited to, biguanide compounds.Similar to biguanide compounds, quats are also capable of impartingbroad spectrum antimicrobial or germicidal properties to the cleaningcomposition. In another and/or alternative embodiment, the generalstructure for the one or more quats that can be included in the cleaningcomposition is:

wherein X is an anion such as, but not limited to, a halide, acetate,nitrite, a lower alkosulfate, carbonate and/or an alkyl carboxylate; andR1-R4 are straight chain, branched chain and/or cyclic chain groups.R1-R4 can be the same or different. In one aspect of this embodiment,one or more of the quats included in the cleaning composition have atleast one higher molecular weight group and at least one lower molecularweight group linked to a common, positively charged nitrogen atom. Theone or more higher molecular weight groups include, but are not limitedto, higher alkyl groups containing about 6-30 carbon atoms that arebranched, unbranched, saturated and/or unsaturated. The one or morelower molecular weight groups include, but are not limited to, 1-12carbon atoms that are branched, unbranched, saturated, and/orunsaturated. Specific lower molecular weight substituents include, butare not limited to, alkyls of 1 to 4 carbon atoms (e.g., methyl andethyl), alkyl ethers, hydroxyalkyls, and/or benzyls. One or more of thehigher and/or lower molecular weight substituents can include, or can bereplaced by, an aryl moiety. Specific aryl moieties include, but are notlimited to, benzyl, ethyl benzyl and/or phenyl. In another and/oralternative aspect of this embodiment, an electrically balancing anion(counterion) is linked to the positively charged nitrogen atom. Specificanions include, but are not limited to, bromide, sulfate, iodide,alkycarboxylate, methosulfate, ethosulfate, phosphate, carboxylic acid,or chloride. In still another and/or alternative aspect of thisembodiment, specific quats that can be used in the cleaning formulationinclude, but are not limited to, alkyl ammonium halides such as lauryltrimethyl ammonium chloride and dilauryl dimethyl ammonium chloride;alkyl aryl ammonium halides such as octadecyl dimethyl benzyl ammoniumbromide; ethyl dimethyl stearyl ammonium chloride, trimethyl stearylammonium chloride, trimethyl cetyl ammonium chloride, dimethyl ethyllauryl ammonium chloride, dimethyl propyl myristyl ammonium chloride,dinonyl dimethyl ammonium chloride, didecyl dimethyl ammonium chloride,diundecyl dimethyl ammonium chloride, didecyl dimethyl ammoniumchloride, dinonyly ethyl ammonium chloride, dimethyl ethyl benzylammonium chloride, 3-(trimethyxyosilyl) propyldidecylmethyl ammoniumchloride, 3-(trimethoxysilyl) propyloctadecycdimethyl ammonium chloride,dimethyl dioctyl ammonium chloride, didecyl dimethyl ammonium chloride,didodecyl dimethyl ammonium chloride, dimethyl ditetradecyl ammoniumchloride, dihexadecyl dimethyl ammonium chloride, dimethyl dioctadecylammonium chloride, decyl dimethyl octyl ammonium chloride, dimethyldodecyloctyl ammonium chloride, benzyl decyl dimethyl ammonium chloride,benzyl dimethyl dodecyl ammonium chloride, benzyl dimethyl tetradecylammonium chloride, decyl dimethyl (ethyl benzyl) ammonium chloride,decyl dimethyl (dimethyl benzyl)-ammonium chloride, (chlorobenzyl)-decyldimethyl ammonium chloride, decyl-(dichlorobenzyl)-dimethyl ammoniumchloride, benzyl didecyl methyl ammonium chloride, benzyl didocyl methylammonium chloride, benzyl ditetradecyl methyl ammonium chloride, benzyldodecyl ethyl methyl ammonium chloride, and N-alkyl Dimethyl BenzylAmmonium Chloride, and N-alkyl Ethylbenzyl Ammonium Chloride and/or thelike.

Nonlimiting types of quat that can be used in the cleaning compositioninclude an alkyldimethylbenzylammonium quat, analkyldimethylethylbenzylammonium quat and/or an alkyldimethylammoniumquat. Nonlimiting specific quat that can be used in the cleaningcomposition is a combination of n-alkyldimethylbenzylammonium chloride(C14—60%, C16—30%, C12—5%, C16—5%) andn-alkyldimethylethylbenzylammonium chloride (C12—68%, C14—32%);available as BTC 2125M from Stepan. Other suitable alkyldimethylbenzylammonium chlorides are available such as Barquat MB-50 from Lonza;di(C6-C14)alkyl di(C1-4 alkyl and/or hydroxyalkyl) quaternary ammoniumcompounds such as Bardac 2050 and/or 2250 from Lonza, (3-chloroallyl)hexaminium chlorides such as Dowicide and Dowicil available from Dow;benzethonium chloride such as Hyamine, methylbenzethonium chloriderepresented by Hyamine IOX, cetylpyridinium chloride such as Cepacolchloride available from of Merrell Labs.

When one or more quats are included in the cleaning composition, thequat content of the cleaning composition is typically maintained aboveabout 0.0005 weight percent and less than about 10 weight percent;preferably 0.01 to about 5% by weight; or 0.01 to about 2% by weight oreven 0.01 to about 1% by weight. In another and/or alternativeembodiment, the quat content of the cleaning composition is greater thanabout 0.04 weight percent of the cleaning composition when the quatfunctions as the primary biocide in the cleaning composition. As can beappreciated, when other biocides are included with the one or more quatsin the cleaning composition, the quat content can be lower than about0.04 weight percent of the cleaning composition. The weight percentagerange for the quat in the cleaning composition is selected to disinfect,sanitize, and/or sterilize most common household, institutional, andindustrial hard surfaces. Common types of bacteria that are at leastpartially destroyed by the quat in the cleaning composition include, butare not limited to, Staphylococcus aureus (Staph), Klebsiella pneumonia(Kleb), Salmonella choleraesuis (Salmonella), Pseudomonas aeruginosa,Pserratia marcescens, Influenza A2, Candida albicans, Fusarium solani,common viruses and/or fungi.

The upper limit to the quat content of the cleaning composition can besignificantly greater than about 0.04 weight percent; however, the quatcontent is typically limited by economic cost considerations, local,state and/or federal regulatory restrictions, formula solubilityrequirements, streaking properties of the cleaning composition, skinirritation considerations, and/or the intended use of the cleaningcomposition. Typically, the quat content of the cleaning composition isno more than about 5 weight percent. In addition, a quat contentexceeding about 5 weight percent may be subject to strict local, stateand/or federal regulations due to the toxicity of the cleaningcomposition. In one aspect of this embodiment, the quat content of thecleaning composition is about 0.05-5 weight percent. In another aspectof this embodiment, the quat content of the cleaning composition isabout 0.08-5 weight percent. In still another aspect of this embodiment,the quat content of the cleaning composition is about 0.1-2 weightpercent. In yet another aspect of this embodiment, the quat content ofthe cleaning composition is about 0.1-1 weight percent. In still yetanother aspect of this embodiment, the quat content of the cleaningcomposition is about 0.15-0.8 weight percent. In a further aspect ofthis embodiment, the quat content of the cleaning composition is about0.175-0.6 weight percent. In yet a further aspect of this embodiment,the quat content of the cleaning composition is about 0.2-0.5 weightpercent. In still a further aspect of this embodiment, the quat contentof the cleaning composition is about 0.25-0.4 weight percent.

In yet another and/or alternative aspect of the present invention, thecleaning composition includes and/or is used in combination with one ormore additional biocides used in combination with the biguanide compoundand/or quat. Such biocides can include, but are not limited to,alcohols, peroxides, boric acid and borates, chlorinated hydrocarbons,organometallics, halogen-releasing compounds, mercury compounds,metallic salts, pine oil, organic sulfur compounds, iodine compounds,silver nitrate, quaternary phosphate compounds, and/or phenolics.

B. The Solvent

The solvent used in and/or in combination with the cleaning compositionis selected to at least partially dissolve into solution the biguanidecompound, quat, and/or other organic compounds in the cleaningcomposition. The use of certain solvents can also improve the cleaning,biocidal and/or detergency properties of the cleaning composition.Generally, the one or more solvents include in and/or used incombination with the cleaning composition include, but are not limitedto, C1-6 alkanols, C1-6 diols, C1-10 alkyl ethers of alkylene glycols,C3-24 alkylene glycol ethers, and/or polyalkylene glycols. The solventcontent of the cleaning composition is generally maintained above about0.1 weight percent and generally less than about 10 weight percent;however, higher or lower solvent contents can be used. Typically, thesolvent content of the cleaning composition is about 0.5-5 weightpercent. The low-VOC solvents such as, but not limited to glycol ethersare particularly desirable because they help the cleaning compositionsmeet the strict local, state and/or federal regulations for increasinglylow VOC requirements. In one embodiment of the invention the firstsolvent is a low-VOC solvent which is about 0.1-5% by weight; or 0.1-3%by weight or even 0.1-2% by weight of the cleaning composition. In oneembodiment of the invention, the low-VOC solvent includes ethyleneglycol monohexyl ether.

Various solvent combinations in the cleaning composition can alsofacilitate in the reduction of filming and/or streaking. One particularsolvent combination that results in reduced filming and/or streaking isa solvent combination that includes a first solvent comprising a glycolether and a second solvent selected from the group consisting of:alcohols, diols, C1-10 alkyl ethers of alkylene glycols, C3-24 alkyleneglycol ethers; polyalkylene glycols, short chain carboxylic acids, shortchain esters, isoparaffinic hydrocarbons, mineral spirits,alkylaromatics, terpenes, terpene derivatives, terpenoids, terpenoidderivatives, formaldehyde, pyrrolidones, water, and any mixtures orcombinations thereof. In one embodiment of the invention, the secondsolvent is about 0.1-5% by weight; or 0.1-3% by weight or 0.1-2% byweight; or even less than 1% by weight of the cleaning composition.Suitable solvents that can be used in the cleaning composition include,but are not limited to, methanol, ethanol, isopropanol, propanol, butylalcohol, sec-butyl alcohol, isobutyl alcohol, tert-butyl alcohol, pentylalcohol, tert-pentyl alcohol, 2-pentanol, 3-pentanol, neopentyl alcohol,allyl, crotyl, methylvinyl-carbinol, ethyl ether, -propyl ether,isopropyl ether, -butyl ether, vinyl ether, allyl ether, ethyleneglycolmethylether, ethyleneglycol ethylether, ethyleneglycol propylether,propyleneglycol methylether, propyleneglycol ethylether, ethyleneglycolmethyletheracetate, and/or propyleneglycol methyletheracetate, ethyleneglycol, propylene glycol, butanediol, methylpropanediol, ethyleneglycolbutylether, ethyleneglycol hexylether, ethyleneglycol ethylhexylether,diethyleneglycol methylether, diethyleneglycol ethylether,diethyleneglycol propylether, diethyleneglycol butylether,propyleneglycol-propylether, propyleneglycol t-butylether,propyleneglycol-butylether, dipropyleneglycol methylether,dipropyleneglycol ethylether, dipropyleneglycol-propylether,dipropyleneglycol t-butylether, dipropyleneglycol-butylether,tripropyleneglycol methylether, tripropyleneglycol-butylether,ethyleneglycol ethyletheracetate, propyleneglycol ethyletheracetate,ethyleneglycol butyletheracetate, propyleneglycol butyletheracetate,diethyleneglycol methyletheracetate, dipropyleneglycolmethyletheracetate, diethyleneglycol ethyletheracetate,dipropyleneglycol ethyletheracetate, diethyleneglycol butyletheracetate,dipropyleneglycol butyletheracetate, ethylene glycol monohexyl etherand/or N-methyl-2-pyrrolidone.

C. The Surfactant

The surfactant used in and/or in combination with the cleaningcomposition is selected to improve the cleaning performance of thecleaning composition. The surfactant can also reduce the amount ofperceived filming and/or streaking of the cleaning composition. Thesurfactant also can provide detergency to the cleaning composition tofacilitate in the removal of soil from the hard surface. The surfactantalso can reduce the amount of redeposition of soils onto the hardsurface.

In one aspect of the invention, the surfactant is a non-ionicsurfactant. In one embodiment the surfactant includes, but is notlimited to, at least one lauryl sulfate, lauryl ether sulfate,cocamidopropylbetaine, alkyl polyglycoside, ethoxylated alcohol,propoxylated alcohol, fluorosurfactant, amine oxide and any combinationsor mixtures thereof. In one particular formulation, the surfactant inand/or used in combination with the cleaning composition includes alkylpolyglycosides, ethoxylated alcohol, fluorosurfactant, ethylene oxideand propylene oxide alcohols (EO-PO surfactants), polyglycol etherand/or amine oxides. Specific kinds of surfactants that can be includedin the cleaning composition are: polyglycol ether surfactants sold underthe brand Tergitol by Dow, alcohol ethoxylates sold under the brandEcosurf by Dow, ethoxylated alcohol sold under the Surfonic by Huntsman,and/or EO-PO surfactants sold under the brand Pluronic by BASF.

A variety of surfactants can be used in and/or use in combination withthe cleaning composition. Such surfactants include, but are not limitedto, nonionic, semi-polar, anionic, cationic, zwitterionic, and/oramphoteric surfactants. Many of these surfactants are described inMcCutcheon's Emulsifiers and Detergents (1997), Kirk-Othmer,Encyclopedia of Chemical Technology, 3rd Ed., Volume 22, pp. 332-432(Marcel-Dekker, 1983), and McCutcheon's Soaps and Detergents (N. Amer.1984), the contents of which are hereby incorporated by reference.Typically the surfactant is partially or fully soluble in water.

In one embodiment of the invention, the cleaning composition onlycontains nonionic surfactants. In another embodiment, the surfactantincludes, but is not limited to, glycoside, glycols, ethylene oxide andmixed ethylene oxide/propylene oxide adducts of alkylphenols, theethylene oxide and mixed ethylene oxide/propylene oxide adducts of longchain alcohols or of fatty acids, mixed ethylene oxide/propylene oxideblock copolymers, esters of fatty acids and hydrophilic alcohols,sorbitan monooleates, alkanolamides, soaps, alkylbenzene sulfonates,olefin sulfonates, paraffin sulfonates, propionic acid derivatives,alcohol and alcohol ether sulfates, phosphate esters, amines, amineoxides, alkyl sulfates, alkyl ether sulfates, sarcosinates,sulfoacetates, sulfosuccinates, cocoamphocarboxy glycinate, salts ofhigher acyl esters of isethionic acid, salts of higher acyl derivativesof taurine or methyltaurine, phenol poly ether sulfates, higher acylderivatives of glycine and methylglycine, alkyl aryl polyether alcohols,salts of higher alkyl substituted imadazolinium dicarboxylic acids,ferchorics, tannics, naphthosulfonates, monochloraceticsanthraflavinics, hippurics, anthranilics, naphthoics, phthalics,carboxylic acid salts, acrylic acids, phosphates, alkylamineethoxylates, ethylenediamine alkoxylates, betaines, sulfobetaines,and/or imidazolines.

The surfactant content in and/or used in combination with the cleaningcomposition is generally at least about 0.001 weight percent of thecleaning composition. In another aspect of this embodiment, thesurfactant content in and/or used in combination with the cleaningcomposition is about 0.01-5 weight percent. Typically the surfactant isat least about 0.05 weight percent and less than about 2 weight percentof the cleaning composition, and more typically about 0.1-2 weightpercent of the cleaning composition. In yet a further aspect of thisembodiment, the surfactant content in and/or used in combination withthe cleaning composition is about 0.15-1.5 weight percent. In still yeta further aspect of this embodiment, the surfactant content in and/orused in combination with the cleaning composition is about 0.2-1.5weight percent. In another aspect of this embodiment, the surfactantcontent in and/or used in combination with the cleaning composition isabout 0.2-1.25 weight percent. In yet another aspect of this embodiment,the surfactant content in and/or used in combination with the cleaningcomposition is about 0.5-1.25 weight percent. In still another aspect ofthis embodiment, the surfactant content in and/or used in combinationwith the cleaning composition is about 0.1-1 weight percent. In stillyet another aspect of this embodiment, the surfactant content in and/orused in combination with the cleaning composition is about 0.15-0.8weight percent. In a further aspect of this embodiment, the surfactantcontent in and/or used in combination with the cleaning composition isabout 0.2-0.4 weight percent. In yet a further aspect of thisembodiment, the surfactant content in and/or used in combination withthe cleaning composition is less than about 0.5 weight percent.

D. Water

The cleaning composition typically includes water. When the cleaningcomposition is a liquid, water based, ready-to-use cleaner, the watercontent of the cleaning composition is generally over 70 weight percentof the cleaning composition. Typically, the liquid ready-to-use cleaningcomposition includes at least about 90 weight percent water; however,higher or lower water contents can be used. When the cleaningcomposition is a liquid, non-water based, ready-to-use cleaner, thewater content of the cleaning composition is generally less than about30 weight percent of the cleaning composition, and typically less thanabout 15 weight percent of the cleaning composition.

The water used in the cleaning composition is typically deionized waterand/or industrial soft water so as to reduce residue formation and limitthe amount of undesirable metal ions in the cleaning composition;however, other types of water can be used (e.g., tap water, springwater, filtered water, etc.).

E. Biocide Release Agent

When the cleaning composition is loaded onto an absorbent or adsorbentmaterial, and/or is to be used with an absorbent or adsorbent material,a biocide release agent is optionally included in and/or used with thecleaning composition to improve the release of the biguanide compound,quat, and/or other cationic biocides in the cleaning composition fromthe absorbent and/or adsorbent material. The biocide release agent usedin the cleaning composition typically includes a cationic compounddesigned to compete with the cationic biocide (e.g., biguanide compound,quat, etc.) for anionic species sites on the absorbent and/or adsorbentmaterial (e.g., sponges (e.g., cellulose, synthetic, etc.), papertowels, cleaning pads, cleaning wipes, napkins, cloths, towels, rags,mop heads, squeegee). The cationic biocide release agent typicallyincludes a cationic salt. Generally, a commonly available salt is usedso as to minimize the raw material cost of the cleaning composition. Inaddition, a salt having a relatively high ionic strength per mole ofsalt is selected to minimize the amount of salt needed in the cleaningcomposition so as to also minimizing the raw material cost of thecleaning composition. Nonlimiting examples of salts that can be used asa biocide release agent in and/or in combination with the cleaningcomposition include potassium citrate, sodium citrate, magnesiumsulphate, sodium chloride, ammonium chloride, and/or potassium chloride.Generally, the one or more salts are added to and/or used in combinationwith the cleaning composition in an amount to cause over about 50% ofthe cationic biocide to be released from the absorbent or adsorbentmaterial when used to clean a hard surface. Generally, the ionicstrength of the one or more salts that make up the biocide release agentused in and/or used in combination with the cleaning composition isabout 1×10-2-2 mol/l, and the weight percent of the salt used in and/orin combination with the cleaning composition is about 0-5 weightpercent; preferably 0-2%; most preferably less than 1% by weight.

F. Additional Anti-Microbial Compound

One or more additional anti-microbial compounds can be included inand/or used in combination with the cleaning composition to enhance thebiocidal efficacy of the cleaning composition. Such anti-microbialcompounds include, but are not limited to, diisobutylphenoxyethoxyethyldimethylbenzyl ammonium chloride, commercially available as Hyamine 1622from Lonza. Other anti-microbial compounds include, but are not limitedto, alcohols, peroxides, boric acid and borates, chlorinatedhydrocarbons, organometallics, halogen-releasing compounds, mercurycompounds, metallic salts, pine oil, essential oils, organic sulfurcompounds, iodine compounds, silver nitrate and other silver compounds,quaternary phosphate compounds, and/or phenolics.

G. Additional Adjuvants

The cleaning composition may optionally include and/or be used incombination with one or more additional adjuncts. The adjuncts include,but are not limited to, fragrances or perfumes, waxes, dyes and/orcolorants, solubilizing materials, stabilizers, thickeners, defoamers,hydrotropes, buffers, builders, lotions and/or mineral oils, enzymes,bleaching agents, cloud point modifiers, and/or preservatives. A varietyof builder detergents can be used in and/or used in combination with thecleaning composition. Such builder detergents include, but are notlimited to, phosphate-silicate compounds, zeolites, alkali metal,ammonium and substituted ammonium polyacetates, mono-, di-, andtri-alkali salts of nitrilotriacetic acid, carboxylates, aluminosilicatematerials, silicates, polycarboxylates, zeolites, carbonates,phosphates, bicarbonates, polyphosphates, amines, alkanolamines,aminopolycarboxylates, polyhydroxysulfonates, starch derivatives,ethylenediamine tetraacetate, and/or metal ion sequestrants (e.g.,aminopolyphosphonates such as, but not limited to, ethylenediaminetetramethylene phosphonic acid and diethylene triaminepentamethylenephosphonic acid). In one embodiment, the builder detergentincludes polyacetate and/or polycarboxylate compounds. In one aspect ofthis embodiment, the polyacetate and/or polycarboxylate compoundsinclude, but are not limited to, sodium, potassium, lithium, ammonium,and substituted ammonium salts of ethylenediamine tetraacetic acid,ethylenediamine triacetic acid, ethylenediamine tetrapropionic acid,diethylenetriamine pentaacetic acid, nitrilotriacetic acid,oxydisuccinic acid, iminodisuccinic acid, mellitic acid, polyacrylicacid or polymethacrylic acid and copolymers, benzene polycarboxylicacids, gluconic acid, sulfamic acid, oxalic acid, phosphoric acid,phosphonic acid, organic phosphonic acids, acetic acid, and citric acid.In one embodiment, the buffering and pH adjusting agents, when used,include, but are not limited to, organic acids, mineral acids, alkalimetal and alkaline earth salts of silicate, metasilicate, polysilicate,borate, carbonate, carbamate, phosphate, polyphosphate, pyrophosphates,triphosphates, tetraphosphates, ammonia, hydroxide, monoethanolamine,monopropanolamine, diethanolamine, dipropanolamine, triethanolamine,and/or 2-amino-2methylpropanol. The buffering agent can be an activedetergent in its own right, and/or can be a low molecular weight,organic or inorganic material used for maintaining the desired pH. Thebuffer can be alkaline, acidic or neutral. Non-limiting examples ofbuffering agents include nitrogen-containing materials (e.g., lysine;lower alcohol amines like mono-, di-, and triethanolamine;tri(hydroxymethyl) amino methane; 2-amino-2-ethyl-1,3-propanediol;2-amino-2-methyl-propanol; 2-amino-2-methyl-1,3-propanol; disodiumglutamate; methyl diethanolamide; 2-dimethylamino-2-methylpropanol;1,3-bis(methylamine)-cyclohexane; 1,3-diamino-propanolN,N′-tetra-methyl-1,3-diamino-2-propanol;N,N-bis(2-hydroxyethyl)glycine; tris(hydroxymethyl)methyl glycine;ammonium carbamate; citric acid; acetic acid; ammonia; alkali metalcarbonates; and/or alkali metal phosphates). For additional buffers thatcan be used, see McCutcheon's EMULSIFIERS AND DETERGENTS, North AmericanEdition, 1997, McCutcheon Division, MC Publishing Company which isincorporated herein by reference. In yet another and/or alternativeembodiment, the solubilizing materials, when used, include, but are notlimited to, hydrotropes (e.g., water soluble salts of low molecularweight organic acids such as the sodium and/or potassium salts of xylenesulfonic acid). In another and/or alternative embodiment, the acids,when used, include, but are not limited to, organic hydroxy acids,citric acids, keto acid, and the like. In still another and/oralternative embodiment, thickeners, when used, include, but are notlimited to, polyacrylic acid, xanthan gum, calcium carbonate, aluminumoxide, alginates, guar gum, methyl, ethyl, clays, and/orpropylhydroxycelluloses. In yet another and/or alternative embodiment,defoamers, when used, include, but are not limited to, silicones,aminosilicones, silicone blends, and/or silicone/hydrocarbon blends. Inyet a further and/or alternative embodiment, bleaching agents, whenused, include, but are not limited to, peracids, perborates,percarbonates, chlorine-generating substances (e.g., chloroisocyanurateshypohalite sources), hydrogen peroxide, and/or sources of hydrogenperoxide. In still a further and/or alternative embodiment,preservatives, when used, include, but are not limited to, mildewstatsor bacteriostats, methyl, ethyl and propyl parabens, short chain organicacids (e.g., acetic, lactic and/or glycolic acids), bisguanidinecompounds (e.g., Dantagard and/or Glydant) and/or short chain alcohols(e.g., ethanol and/or IPA). In one aspect of this embodiment, themildewstats or bacteriostats include, but are not limited to,mildewstats (including non-isothiazolone compounds) include Kathon GC, a5-chloro-2-methyl-4-isothiazolin-3-one, Kathon ICP, a2-methyl-4-isothiazolin-3-one, and a blend thereof, and Kathon 886, a5-chloro-2-methyl-4-isothiazolin-3-one, all available from Rohm and HaasCompany; Bronopol, a 2-bromo-2-nitropropane-1,3-diol, from Boots CompanyLtd.; Proxel CRL, a propyl-p-hydroxybenzoate, from ICI PLC; Nipasol M,an o-phenyl-phenol, Na+ salt, from Nipa Laboratories Ltd.; Dowicide A, a1,2-Benzoisothiazolin-3-one, from Dow Chemical Co.; and Irgasan DP 200,a 2,4,4′-trichloro-2-hydroxydiphenylether, from Ciba-Geigy A.G.

In still a further and/or alternative aspect of the present invention,the cleaning composition has a neutral or alkaline pH. Various compounds(e.g., adjuncts, biocides, etc.) can be added to and/or used incombination with the cleaning composition to control the pH of thecleaning composition. In one embodiment, the pH of the cleaningcomposition is about neutral. In one aspect of this embodiment, the pHof the cleaning composition is between about 5-9. In another aspect ofthis embodiment, the pH of the cleaning composition is between about6-8.

H. The Absorbent and/or Adsorbent Material

The cleaning composition, when used to clean hard surfaces, is generallyused in conjunction with one or more absorbent and/or adsorbentmaterials. The cleaning composition can be sprayed and/or poured onto ahard surface to be cleaned and an absorbent and/or adsorbent materialsuch as, but not limited to, a sponge, mop head, cloth, towel, and thelike is then used to spread the cleaning composition on the hard surfaceand/or clean the hard surface. Additionally or alternatively, thecleaning composition is at least partially loaded on the absorbentand/or adsorbent material prior to the absorbent and/or adsorbentmaterial at least partially applying the cleaning composition onto thehard surface and/or cleaning the hard surface.

The present invention also contemplates the pre-loading of the cleaningcomposition on a cleaning pad and/or cleaning wipe. In one embodiment,the cleaning wipe includes, but is not limited to, a woven and/or anonwoven material. In one aspect of this embodiment, the nonwovenmaterial includes, but is not limited to, nonwoven, fibrous sheetmaterials. In another and/or alternative aspect of this embodiment, thenonwoven material includes, but is not limited to, meltblown, coform,air-laid, spun bond, wet laid, bonded-carded web materials, and/orhydroentangled (also known as spunlaced) materials. In still anotherand/or alternative aspect of this embodiment, the woven materialincludes, but is not limited to, cotton fibers, cotton/nylon blendsand/or other textiles. In another and/or alternative embodiment, thecleaning wipe includes a sponge and/or sponge-like material. In oneaspect of this embodiment, the sponge and/or sponge-like materialincludes, but is not limited to, regenerated cellulose and/orpolyurethane foams. In still another and/or alternative embodiment, thecleaning wipe includes, but is not limited to, wood pulp, a blend ofwood pulp, and/or synthetic fibers. In one aspect of this embodiment,the synthetic fibers include, but are not limited to, polyester, rayon,nylon, polypropylene, polyethylene, and/or cellulose polymers. In stillanother and/or alternative embodiment, the cleaning wipe includes abinder.

The cleaning composition on the cleaning pad or cleaning wipe istypically in a ready to use liquid form; however, the cleaningcomposition can be in a concentrate in liquid, semi-liquid or solid formon the cleaning pad or cleaning wipe. Typically, the cleaning wipe hasat least one layer of nonwoven material. The cleaning pad can alsoinclude one or more layers of nonwoven material.

Manufacturers of cleaning wipes that can be used in the presentinvention include, but are not limited to, Suominen, PGI,Kimberly-Clark, E.I. Du Pont de Nemours and Company, Dexter, AmericanNonwovens, and James River, BBA Nonwoven. Specific, nonlimiting examplesof cleaning wipes from these manufacturers are disclosed in Bouchette etal., U.S. Pat. Nos. 4,781,974 and 4,615,937; Clark et al, U.S. Pat. No.4,666,621; Amundson et al., WO 98/03713; Cabell et al., U.S. Pat. No.5,908,707; Mackey et al., WO 97/40814; Mackey et al., WO 96/14835; andMoore, EP 750063, all of which are incorporated herein by reference.

The cleaning pad typically has an absorbent capacity, when measuredunder a confining pressure of 0.09 psi after 20 minutes, of at leastabout 1 g deionized water per g of the cleaning pad. The cleaning padwill also typically have a total fluid capacity (of deionized water) ofat least about 100 g. However, the absorbency and/or fluid capacity ofthe cleaning pad can vary depending on the desired use of the cleaningpad. The cleaning wipe can have the same or different amount ofabsorbency.

The loading ratio of the cleaning composition onto the cleaning wipe orcleaning pad can be about 2-5:1, and typically about 3-4:1; however,other loading ratios can be used. In a further and/or alternativeembodiment, the liquid loading capacity of the cleaning wipe or pad issufficient to retain the desired amount of cleaning composition on thecleaning wipe or pad. In one aspect of this embodiment, the liquidloading capacity of the cleaning wipe or pad is at least about 10% ofthe dry weight of the cleaning wipe or pad. In another and/oralternative aspect of this embodiment, the liquid loading capacity ofthe cleaning wipe or pad is about 50%-1000% of the dry weight of thecleaning wipe or pad. This loading capacity is expressed as loading ½ to10 times the weight (or, more accurately, the mass) of the dry cleaningwipe or pad. In still another and/or alternative aspect of thisembodiment, the liquid loading capacity of the cleaning wipe or pad isabout 200%-800% of the dry weight of the cleaning wipe or pad. In yetanother and/or alternative aspect of this embodiment, the liquid loadingcapacity of the cleaning wipe or pad is about 250%-500% of the dryweight of the cleaning wipe or pad. In still yet another and/oralternative aspect of this embodiment, the liquid loading capacity ofthe cleaning wipe or pad is about 300%-450% of the dry weight of thecleaning wipe or pad. In still a further and/or alternative embodiment,the cleaning composition is impregnated, dosed, loaded, metered, and/orotherwise dispensed onto the cleaning wipe or pad. The loading of thecleaning wipe or pad can be accomplished in several ways including, butnot limited to, treating each individual wipe or pad with a discreteamount of cleaning composition, mass treating a continuous web ofcleaning wipes with the cleaning composition, soaking the entire web ofcleaning wipes in the cleaning composition, spraying the cleaningcomposition in a stationary or moving web of cleaning wipes, and/orimpregnating a stack of individually cut and sized cleaning wipes or padin a container and/or a dispenser. In another and/or alternativeembodiment, the cleaning wipe or pad has a wet tensile strength of atleast about 25-250 Newton/m. In one aspect of this embodiment, thecleaning wipe or pad has a wet tensile strength of about 25-250Newton/m. In another and/or alternative aspect of this embodiment, thecleaning wipe or pad has a wet tensile strength of about 75-170Newton/m. The cleaning composition can be loaded onto the cleaning wipeand/or cleaning pad in any number of manufacturing methods. Typically,the cleaning wipe or cleaning pad is sprayed with or soaked in thecleaning composition for a period of time until the desired amount ofloading is achieved.

The cleaning pad or cleaning wipe can also be part of a cleaning kit ortool. The cleaning pad or cleaning wipe can also have an attachmentlayer that allows the cleaning pad or cleaning wipe to be connected toand/or disconnected from an implement's handle or the support head or animplement (e.g., mop, broom, etc.). The attachment layer can alsofunction to prevent fluid flow through the top surface (e.g., thehandle-contacting surface) of the cleaning pad or cleaning wipe, and/orcan further provide enhanced integrity for the cleaning pad or cleaningwipe. The kit can have an assembly of one or more units, either packagedtogether or separately. The kit can comprise an implement containing acleaning pad or cleaning wipe that may or may not include asuperabsorbent material, and the cleaning composition. The cleaning pador cleaning wipe can be detachably mounted on the implement so that thecleaning pad or cleaning wipe can be removed and/or replaced with afresh clean pad or cleaning wipe. The implement can also have areservoir that contains the cleaning composition. The reservoir can berefillable or contain a non-refillable amount of cleaning composition.The reservoir can also be detachably mounted on the implement to allowfor easy refilling or replacing with a filled reservoir.

In still a further and/or alternative embodiment of the presentinvention, the cleaning wipes and/or pads can have an attachment layerthat allows the wipe and/or pad to be connected to an implement's handleor the support head of various implements. The attachment layer is usedin those embodiments where the absorbent and/or adsorbent layer is notsuitable for attaching the wipe and/or pad to the support head of thehandle. The attachment layer can also function as a mechanism to inhibitor prevent fluid flow through the top surface (e.g., thehandle-contacting surface) of the cleaning wipe and/or pad, and/or canprovide enhanced integrity of the wipe and/or pad. In one aspect of thisembodiment, the attachment layer can consist of a mono-layer or amulti-layer structure. In another and/or alternative aspect of thisembodiment, the attachment layer can comprise a surface which is capableof being mechanically attached to the handle's support head by use of ahook and loop system. In one specific design, the attachment layer cancomprise at least one surface which is mechanically attachable to hooksthat are affixed to the bottom surface of the handle's support head.

In another and/or alternative aspect of the present invention, thecleaning wipe or pad can be individually sealed with a heat-sealableand/or glueable thermoplastic overwrap such as, but not limited to,polyethylene, Mylar and the like. In one embodiment, the cleaning wipesor pads are packaged as numerous, individual sheets or pads which are atleast partially, impregnated with the cleaning composition of thepresent invention. In another and/or alternative embodiment, thecleaning wipes are at least partially formed as a continuous web duringthe manufacturing process and loaded into a dispenser such as, but notlimited to, a canister with a closure or a tub with closure. The closureis at least partially used to seal the loaded cleaning wipes from theexternal environment and/or prevent premature volatilization of thecomponents of the cleaning composition. In one aspect of thisembodiment, the dispenser includes a plastic such as, but not limitedto, high density polyethylene, polypropylene, polycarbonate,polyethylene terephthalate (PET), polyvinyl chloride (PVC), and/or otherrigid plastic. In another aspect and/or alternative of this embodiment,the continuous web of cleaning wipes is at least partially threadedthrough an opening in the top of the dispenser. In still another and/oralternative aspect of this embodiment, the dispenser includes a severingarrangement to cut at least a portion of the cleaning wipe after beingat least partially removed from the dispenser. The severing arrangementcan include, but is not limited to, a knife blade, serrated edge, and/orthe like. In still yet another and/or alternative aspect of thisembodiment, the continuous web of cleaning wipes can be scored, folded,segmented, and/or partially cut into uniform and/or non-uniform sizes,and/or lengths. In a further and/or alternative aspect of thisembodiment, the cleaning wipes can be interleafed so that the removal ofone cleaning wipe advances the next in the opening of the dispenser.

1. Experimental Procedure for Optical Microscopy of Droplet Residue

FIGS. 3, 4 and 5 are all optical microscopy photos of droplet residueswhich were created using the following process.

Sample Preparation

Lotion samples were filtered through a 0.45 μm filter. 0.51 μl dropletsof the lotion sample were placed on the clean polished surface of asilicon wafer (University Wafer, Part No. S3P01SP) and left to dry atroom temperature (23±2° C.), which generally took a few minutes.Multiple droplets for each sample were used to confirm thereproducibility of the experiment.

Microscopy

Dried droplets were imaged using a Leica DM2500 P microscope under thereflection mode. Images were digitally captured using a Leica DFC295digital microscope color camera and Leica software Application Suite,LAS v3.6. In some cases real time movies of drying droplets were alsocaptured using a LAS MultiTime-Movie-Timelapse module. All of thedigital image analysis was performed using the NIH ImageJ 1.44psoftware.

Image Analysis

Images were converted to 8-bit and then to a binary format. Total numberof micro-droplets (μ-droplets) on the image was counted under the‘Analyze Particles’ subroutine of ImageJ software. Reported area ofμ-droplets was converted to an equivalent diameter by approximating thearea to the area of a circle. A frequency histogram of μ-droplet sizeswas then generated from this data. A mean diameter (d) and standarddeviation (σ) was calculated for each distribution. A dispersityparameter was defined to be the ratio of standard deviation and mean(dispersity=σ/d).

FIG. 3 is a microscopy picture of a dried droplet residue of a cleaningcomposition according to the present invention with a low cloud pointand a regular micron-structure. The formulation for the droplet residueshown in FIG. 3 is the one with the cloud point of 79° F. (shown in thetable below). In contrast, FIG. 4 shows a microscopy picture of a drieddroplet residue of a cleaning composition which does not meet thecriteria of the present invention because it has an irregular residuestructure and a high cloud point. The formulation for the dropletresidue shown in FIG. 4 is the one with the cloud point of 110° F.(shown in the table below). Although, these formulations are verysimilar the droplet residue pictures in FIGS. 3 and 4 illustrate thatwithout the proper amount of solvent, in this example it is hexylcellosolve, the cloud point of the formulation may be too high and thisresults in a surface residue that is undesirable for hard surfaces.Conversely, FIG. 3 show a droplet residue with a relatively uniformmicron-structure which appears substantially invisible to the human eyeand is therefore desirable for hard surfaces. FIGS. 3 and 4 illustratethe importance of the right level of hexyl cellosolve in the composition(depending on the surfactant used) in a composition, the right cloudpoint temperature and the creation of a uniform droplet residue pattern.

Using the above described microscopy method, the uniformity of thedroplet residue pattern can be measured by the following reproduciblecriteria: wherein when a 0.5 microliter drop of said compositiondeposited on a clean silicon surface, forms a circular residue where,within the central 80% of the droplet residue image, there is noposition where a 200-micron diameter circle can be placed where it willcontain no boundaries between the dark and light portions of the image.According to these criteria for the uniformity of the micron-structurein the droplet residue, FIG. 3 shows a droplet residue that meets theabove uniformity criteria and FIG. 4 shows a droplet residue that doesnot meet the above uniformity criteria.

Weight % Cloud Cloud Point = Point = Ingredient Purpose Chemical Name79° F. 110° F. Water Water 95.73 96.67 Sodium Buffer 0.0006 0.0006Bicarbonate Citric Acid Buffer 0.0005 0.0005 BTC Active 1. n-Alkyl (C1460%; c16 0.73 0.73 2125M-NA 30%; C12 5%; C16 5%) dimethyl benzylammonium chloride (50%). 2. n-Alkyl (C12 68%; C14 32%) dimethylethylbenzyl ammonium chloride (50%). Isopropyl Solvent 0.45 0.45 alcoholSurfonic P3 Surfactant A straight-chain primary 0.44 0.44 Surfactantaliphatic alkoxylated alcohol Hexyl Solvent Ethylene Glycol 2.468 1.527Cellosolve Monohexyl Ether Fragrance Fragrance 0.18 0.18

FIG. 5 contains a set of four microscopy images created according to theprocedure outlined above. FIG. 5 showing the surface residue of adroplet of low-VOC cleaning compositions of the present invention withthe same surfactant, but different cloud points. The level of hexylcellosolve in the cleaning compositions was varied to create sampleswith different cloud points. The upper left composition has a cloudpoint of 85° F. The upper right composition has cloud point of 83° F.The lower left composition has a cloud point of 81° F. The lower rightcomposition has a cloud point of 78° F. It is clear based on theseresidue photos that the regularity/uniformity of the micron-structurestarts to break down and become less regular around 85° F. The level ofthe glycol ether solvent was varied to achieve samples at these cloudpoint temperatures. This exemplary cleaning composition used to createthese droplet residues has the following general formulation.

FIG. 5 Formulation Quaternary Amine  0.01-1% Glycol Ether Solvent 0.5-3% Alcohol Solvent  0.1-2% EO-PO Surfactant 0.001-1% Buffer0.001-1% Fragrance 0.001-1% Water  90-99%

FIGS. 1 and 2 further illustrate how different cleaning compositionswith different types of nonionic surfactants require varying amounts ofhexyl cellosolve solvent to achieve the same could point temperatures.Although the amount of hexyl cellosolve required to reach a particularcloud point may vary depending on the surfactant, the addition of theappropriate amount of hexyl cellosolve can be used to achieve a lowcloud point cleaning composition with a regular residue microstructurewhich creates the appearance of low streaking and filming on hardsurfaces.

A general formulation of the low-VOC cleaning composition in weightpercent for hard surface cleaning is as follows:

Cationic Biocide 0.01-2% Surfactant 0.01-2% VOC solvent less than about5% Water less than about 99.95%

Several specific, nonlimiting, examples of the low VOC cleaningcomposition according to the present invention in weight percent areshown in Table I.

TABLE I Formulation Components % by wt. Surfonic Surfonic SurfonicPluronic Pluronic Surfonic LF-41 P3 LF-18 L31 L35 LF-37 FormulationFormulation Formulation Formulation Formulation Formulation % Water96.32 96.09 97.07 97.23 96.50 97.88 % Quat 0.37 0.37 0.37 0.37 0.37 0.37% IPA 0.45 0.45 0.45 0.45 0.45 0.45 % Surfactant 0.44 0.44 0.44 0.440.44 0.44 % Fragrance 0.18 0.18 0.18 0.18 0.18 0.18 % Low VOC Solvent2.24 2.47 1.49 1.33 2.06 0.68 (i.e. Ethylene Glycol Monohexyl Ether)Cloud Point 79 79 79 79 79 79 Temp (° F.)

In contrast to Table I, several specific, nonlimiting, examples of thelow VOC cleaning compositions that have high cloud points and exhibitundesirable streaking and filming residues are shown below in Table II.The formulation components are in weight percent in Table II.

TABLE II Formulation Components % by wt. Surfonic Surfonic SurfonicPluronic Pluronic Surfonic LF-41 P3 LF-18 L31 L35 LF-37 FormulationFormulation Formulation Formulation Formulation Formulation % Water97.41 97.03 98.23 98.04 96.96 98.56 % Quat 0.37 0.37 0.37 0.37 0.37 0.37% IPA 0.45 0.45 0.45 0.45 0.45 0.45 % Surfactant 0.44 0.44 0.44 0.440.44 0.44 % Fragrance 0.18 0.18 0.18 0.18 0.18 0.18 % Low VOC Solvent1.15 1.53 0.33 0.52 1.60 0.00 (i.e. Ethylene Glycol Monohexyl Ether)Cloud Point 110 110 110 110 110 110 Temp (° F.)

Table I shows a number of exemplary formulations of the presentinvention containing different EO-PO surfactants which show that verysimilar formulations with different surfactants require varying levelsof hexyl cellosolve solvent to achieve the same cloud point level. Ifthe goal is to create formulations with a low cloud point, then theamount of hexyl cellosolve required for each formulation will varydepending on the specific surfactant chosen for the formulation.Depending on the specific formulation, a low cloud point of less thanabout 95° F., or less than about 90° F. or even less than about 85° F.,will be sufficient to create a cleaning composition with low streakingand filming, characterized by a droplet residue with a regularmicron-structure. What is consistent with all the formulations in TableI is that they all have a low cloud point and they all exhibit a uniformmicron-structure upon drying on a treated surface. In contrast, Table IIshows formulations that are relatively similar to those in Table I, butfor each type of surfactant composition the level of hexyl cellosolvehas gone down, relative to the level in Table I for the same surfactantcomposition, and the cloud point is high, 110° F. What is consistentabout each of the formulations in Table II is that they do not meet thecriteria of the claimed present invention because they all exhibitirregular residue films upon drying on a surface and they all have ahigh cloud point. Most low-VOC formulations with a cloud point over 95°F. do not exhibit good streaking and filming performance and thereforethey are undesirable cleaning compositions for hard surfaces.

The following formulations are non-limiting examples of formulationsaccording to the present invention.

Example 1

Cationic Biocide  0.01-2% VOC Solvent  0.01-4% Surfactant 0.001-1%Buffer 0.001-1% Fragrance 0.001-1% Biocide release agent   0-10% Water0-99.95%

Example 2

Cationic Biocide  0.01-1% VOC Solvent  0.01-2% Surfactant 0.001-1%Buffer 0.001-1% Fragrance 0.001-1% Biocide release agent   0-10% Water90-99.95% 

Example 3

Cationic Biocide  0.01-1% VOC Solvent  0.01-2% EO-PO Surfactant 0.001-1%Buffer 0.001-1% Fragrance 0.001-1% Biocide release agent    0-3% Water90-99.95% 

Example 4

Cationic Biocide  0.01-1% Alcohol  0.01-2% Low-VOC Solvent  0.01-3%Surfactant 0.001-1% Buffer 0.001-1% Fragrance 0.001-1% Biocide releaseagent    0-3% Water 90-99.95% 

Example 5

Cationic Biocide 0.05-5%   Glycol Ether Solvent 0.05-10%    NonionicSurfactant 0.01-5%   Buffer 0-2% Fragrance 0-1% Biocide release agent0-3% Water at least 80%

Example 6

Cationic Biocide 0.05-5%   First Solvent 0.05-10%    Second Solvent 0-2%Nonionic Surfactant 0.01-5%   Buffer 0-2% Fragrance 0-1% Biocide releaseagent 0-3% Water at least 90%

Example 7

Cationic Biocide 0.05-5%   Glycol Ether Solvent 0.05-10%    SecondSolvent 0-2% Nonionic Surfactant 0.01-5%   Buffer 0-2% Fragrance 0-1%Biocide release agent 0-3% Water at least 80%

Example 8

Cationic Biocide 0.05-2%   Glycol Ether Solvent 0.05-10%    SecondSolvent 0-2% EO-PO Surfactant 0.01-5%   Buffer 0-2% Fragrance 0-1% Waterat least 90%

The invention has been described with reference to a preferredembodiment and alternates thereof. It is believed that manymodifications and alterations to the embodiments disclosed will readilysuggest themselves to those skilled in the art upon reading andunderstanding the detailed description of the invention. It is intendedto include all such modifications and alterations insofar as they comewithin the scope of the present invention.

We claim:
 1. A cleaning composition consisting of: i. about 0.01-2% byweight of one or more quaternary ammonium compounds; ii. about 0.001-1%by weight of a surfactant selected from the group consisting of: laurylsulfate, lauryl ether sulfate, cocamidopropylbetaine, alkylpolyglycoside, and any combinations or mixtures thereof; iii. about0.1-2% by weight of a first solvent selected from the group consistingof: C1-10 alkyl ethers of alkylene glycols, C3-24 alkylene glycolethers, and any mixtures or combinations thereof; iv. about 0.1-2% byweight of a second solvent that is different from the first solvent, thesecond solvent being selected from the group consisting of: alcohols,diols, C1-10 alkyl ethers of alkylene glycols, short chain carboxylicacids, and any mixtures or combinations thereof; v. at least about 90%by weight of water; and vi. optionally, one or more adjuncts selectedfrom the group consisting of: buffers in a non-salt form, fragrances,perfumes, defoamers, hydrotropes, enzymes, bleaching agents, dyes,colorants, additional solvents and preservatives; and wherein thecleaning composition has a cloud point that is 95° F. or less.
 2. Thecleaning composition as defined in claim 1, wherein the compositioncomprises a buffer in a non-salt form.
 3. The cleaning composition asdefined in claim 1, wherein the composition comprises a fragrance. 4.The cleaning composition as defined in claim 1, wherein the surfactantis an alkyl polyglycoside.
 5. The cleaning composition as defined inclaim 1, wherein said first solvent includes a C1-10 alkyl ether ofalkylene glycol.
 6. The cleaning composition as defined in claim 1,wherein the first solvent includes a C1-10 alkyl ether of propyleneglycol.
 7. The cleaning composition as defined in claim 1, wherein thesecond solvent is an alcohol.
 8. A cleaning composition consisting of:i. about 0.01-2% by weight of one or more quaternary ammonium compounds;ii. about 0.001-1% by weight of an alkyl polyglycoside surfactant; iii.about 0.1-2% by weight of a first solvent selected from the groupconsisting of: C1-10 alkyl ethers of alkylene glycols, C3-24 alkyleneglycol ethers, and any mixtures or combinations thereof; iv. about0.1-2% by weight of a second solvent that is different from the firstsolvent, the second solvent being selected from the group consisting of:alcohols, diols, C1-10 alkyl ethers of alkylene glycols, short chaincarboxylic acids, and any mixtures or combinations thereof; v. about0.001-1% by weight of a buffer in a non-salt form; vi. at least about90% by weight of water; and vii. optionally, one or more adjunctsselected from the group consisting of: fragrances, perfumes, defoamers,hydrotropes, enzymes, bleaching agents, dyes, colorants, additionalsolvents and preservatives; and wherein the cleaning composition has acloud point that is 95° F. or less.
 9. The cleaning composition asdefined in claim 8, wherein the buffer is monoethanolamine.
 10. Thecleaning composition as defined in claim 8, wherein the compositioncomprises a fragrance.
 11. The cleaning composition as defined in claim8, wherein said one or more quaternary ammonium compounds comprises atleast one of n-alkyldimethylbenzylammonium chloride orn-alkyldimethylethylbenzylammonium chloride.
 12. The cleaningcomposition as defined in claim 8, wherein said cleaning composition hasa cloud point of 90° F. or less.
 13. The cleaning composition as definedin claim 8, wherein the first solvent includes a C1-10 alkyl ether ofalkylene glycol.
 14. The cleaning composition as defined in claim 8,wherein the second solvent is an alcohol.
 15. A cleaning compositionconsisting of: i. about 0.01-2% by weight of one or more quaternaryammonium compounds, ii. about 0.15-1.5% by weight of an alkylpolyglycoside surfactant; iii. about 0.1-2% by weight of a first solventselected from the group consisting of: C1-10 alkyl ethers of alkyleneglycols, C3-24 alkylene glycol ethers, and any mixtures or combinationsthereof, iv. about 0.01-2% by weight of a second solvent, the secondsolvent being one or more alcohols; v. one or more buffers in a non-saltform; vi. one or more fragrances; vii. at least 90% by weight of water;and wherein the cleaning composition has a cloud point that is 95° F. orless.
 16. The cleaning composition as defined in claim 15, wherein saidbuffer is monoethanolamine.
 17. The cleaning composition as defined inclaim 15, wherein the first solvent includes a C1-10 alkyl ether ofpropylene glycol.
 18. The cleaning composition as defined in claim 15,wherein said one or more quaternary ammonium compounds comprises atleast one of n-alkyldimethylbenzylammonium chloride orn-alkyldimethylethylbenzylammonium chloride.
 19. The cleaningcomposition as defined in claim 15, wherein said second solvent isethanol.